Diffusion Bonding and Brazing of Advanced Materials

نویسندگان

چکیده

برای دانلود رایگان متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

Microwave Sintering, Brazing and Melting of Metallic Materials

Microwave energy has been in use for variety of applications for over 50 years. These applications include communication, food processing, wood drying, rubber vulcanization, medical therapy, polymers, etc. In the last two decades microwave heating has been also applied very effectively and efficiently to heat and sinter ceramic materials. Microwave heating is recognized for its various advantag...

متن کامل

morphology, geochemistry, mineralogy, and micromorphology of soils of hormozgan province in relation to parent materials

ویژگی های زمین شیمیایی، کانی شناسی، و میکرومورفولوژیکی خاک ها و سنگ مادر مربوطه در منطقه بین بخش های جنوبی زاگرس و خلیج فارس تا دریای عمان(استان هرمزگان، ایران) مورد بررسی قرار گرفت. هدف های این مطالعه شناسایی تغییرات در خصوصیات فیزیکی، شیمیایی، و ترکیب کانی شناسی خاک، مطالعه میکرومورفولوژی و تکامل خاک، و بررسی توزیع عنصر خاک بر اساس هوازدگی، پروسه های خاک و زمین شناسی جهت توصیف اثرات مواد مادر...

15 صفحه اول

assessment of deep word knowledge in elementary and advanced iranian efl learners: a comparison of selective and productive wat tasks

testing plays a vital role in any language teaching program. it allows teachers and stakeholders, including program administrators, parents, admissions officers and prospective employers to be assured that the learners are progressing according to an accepted standard (douglas, 2010). the problems currently facing language testers have both practical and theoretical implications but the first i...

Adhesive Bonding of Wood Materials

Adhesion to Wood 9–1 Surface Properties of Wood Adherends 9–2 Extractives on Surfaces 9–3 Knifeand Abrasive-Planed Surfaces 9–3 Veneer Surfaces 9–4 Surfaces of Wood and Nonwood Composite Products 9–5 Physical Properties of Wood Adherends 9–6 Density and Porosity 9–6 Moisture Content and Dimensional Changes 9–7 Adhesives 9–9 Composition 9–9 Health and Safety 9–10 Strength and Durability 9–10 Adh...

متن کامل

Wire Bonding to Advanced Copper, Low-K Integrated Circuits, the Metal/Dielectric Stacks, and Materials Considerations

There are three areas to consider when designing/implementing wire bonding to advanced ULSI damascene–copper chips having copper metallization and low dielectric-constant polymers embedded beneath them (Cu/LoK). These are: 1) the copper-pad top-surface oxidation inhibitor coatingmetal/organic/inorganic. (Current work involves evaluating the metal and inorganic options); 2) the low dielectric co...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

ژورنال

عنوان ژورنال: Metals

سال: 2018

ISSN: 2075-4701

DOI: 10.3390/met8110959